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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal characterization of high power LED array in aluminum base copper clad laminate package

✍ Scribed by Hang, Chunjin; Fei, Jingming; Wang, Hong; Wang, Chunqing

Book ID: 120055275
Publisher: IEEE
Year: 2012
Weight: 799 KB
Category: Article
ISBN: 1467316806
DOI: 10.1109/ICEPT-HDP.2012.6474873

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