𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study of 3-D staking assembly based on the package material of PCB

✍ Scribed by Lu, Yu-zhong; Jiang, Jian-guo; Lai, Xin-quan; Wang, Xiu; Huang, Zhan-wu

Book ID: 120166749
Publisher: IEEE
Year: 2012
Weight: 733 KB
Category: Article
ISBN: 1467316806
DOI: 10.1109/ICEPT-HDP.2012.6474641

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - The effect of gelatin on the tin electrodeposition

✍ Zhao, Zi-Shou; Xian, Ai-Ping 📂 Article 📅 2012 🏛 IEEE ⚖ 636 KB

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal resistance analysis by numerical method for power device packaging

✍ Wu, Hao; Chen, Ming; Gao, Liming; Li, Ming 📂 Article 📅 2012 🏛 IEEE ⚖ 917 KB

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Ant-algorithm-annealing-algorithm-based optimization approach for MCM interconnect test

✍ Lei, Chen 📂 Article 📅 2012 🏛 IEEE ⚖ 460 KB

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal characterization of high power LED array in aluminum base copper clad laminate package

✍ Hang, Chunjin; Fei, Jingming; Wang, Hong; Wang, Chunqing 📂 Article 📅 2012 🏛 IEEE ⚖ 799 KB

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Modeling and simulation of a micromachined gyroscope using differential frequency approximate match method

✍ Hu, Chang; Wang, Xuefang; Liu, Sheng 📂 Article 📅 2012 🏛 IEEE ⚖ 578 KB

[IEEE 2012 13th International Conference

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of cooling rate and solder volume on the formation of large Ag3Sn plates in Sn-Ag based solder joints

✍ Zhou, Qiang; Huang, Mingliang; Zhao, Ning; Zhang, Zhijie 📂 Article 📅 2012 🏛 IEEE ⚖ 735 KB