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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Efficient analysis of multilayer microstrip structures by matrix decomposition algorithm — Singular value decomposition

✍ Scribed by Zhaoneng Jiang, ; Maomao Zhu, ; Dazhi Ding, ; Zhenhong Fan, ; Rushan Chen,

Book ID: 115497889
Publisher: IEEE
Year: 2011
Weight: 104 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/edaps.2011.6213723

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