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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Curie temperature effects on resistance spot welding

✍ Scribed by Wu, T. H.; Wei, P. S.

Book ID: 127325030
Publisher: IEEE
Year: 2011
Weight: 903 KB
Category: Article
ISBN: 1457713888
DOI: 10.1109/impact.2011.6117206

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