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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Improved reliability of Sn-Ag-Cu-In solder alloy by the addition of minor elements

✍ Scribed by Yu, A-Mi; Jang, Jae-Won; Kim, Jun-Ki; Lee, Jong-Hyun; Kim, Mok-Soon

No coin nor oath required. For personal study only.

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