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[IEEE 2009 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA) - Hsinchu, Taiwan (2009.04.27-2009.04.29)] 2009 International Symposium on VLSI Technology, Systems, and Applications - Boron carbon nitride film containing hydrogen for 2nm node low-k interconnection

✍ Scribed by Aoki, Hidemitsu; Takuroh Masuzumi, ; Makoto Hara, ; Watanabe, Daisuke; Kimura, Chiharu; Sugino, Takashi

Book ID: 120160258
Publisher: IEEE
Year: 2009
Weight: 256 KB
Category: Article
ISBN: 1424427843
DOI: 10.1109/VTSA.2009.5159270

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