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[IEEE 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2009.03.15-2009.03.19)] 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Thermal resistance measurements of interconnections, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack

✍ Scribed by Matsumoto, Keiji; Taira, Yoichi

Book ID: 115525709
Publisher: IEEE
Year: 2009
Tongue: English
Weight: 383 KB
Volume: 0
Category: Article
ISBN: 1424436648
DOI: 10.1109/stherm.2009.4810783

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