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[IEEE Management Symposium (SEMI-THERM) - San Jose, CA, USA (2011.03.20-2011.03.24)] 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack

✍ Scribed by Matsumoto, Keiji; Ibaraki, Soichiro; Sueoka, Kuniaki; Sakuma, Katsuyuki; Kikuchi, Hidekazu; Orii, Yasumitsu; Yamada, Fumiaki

Book ID: 115525710
Publisher: IEEE
Year: 2011
Weight: 663 KB
Volume: 0
Category: Article
ISBN: 1612847404
DOI: 10.1109/stherm.2011.5767189

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