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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering

✍ Scribed by Bernasko, P.K.; Mallik, S.; Ekere, N.N.; Seman, A.; Takyi, G.

Book ID: 124072386
Publisher: IEEE
Year: 2009
Weight: 527 KB
Category: Article
ISBN: 1424450993
DOI: 10.1109/EPTC.2009.5416398

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