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[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Design-performance aspects of Glass Ceramic in comparison to Alumina Ceramic and organic FCPBGA packages for high link densities of high speed SerDes

✍ Scribed by Hu, Haitian; Na, Nanju; Baez, Franklin; Lafontant, Gary

Book ID: 126745025
Publisher: IEEE
Year: 2008
Weight: 489 KB
Category: Article
ISBN: 1424428734
DOI: 10.1109/EPEP.2008.4675925

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