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[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Sensitivity computation of interconnect capacitances with respect to geometric parameters

โœ Scribed by Bi, Yu; van der Kolk, K.; Ioan, D.; van der Meijs, N.P.


Book ID
126671370
Publisher
IEEE
Year
2008
Weight
448 KB
Category
Article
ISBN
1424428734

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