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[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Impedance design for multi-layered vias

✍ Scribed by Gu, Xiaoxiong; Ruehli, Albert E.; Ritter, Mark B.

Book ID: 120282414
Publisher: IEEE
Year: 2008
Weight: 348 KB
Category: Article
ISBN: 1424428734
DOI: 10.1109/EPEP.2008.4675944

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