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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Analysis of signal integrity/power integrity in multilayer printed circuit board and two improving methods

✍ Scribed by Hee-do Kang, ; Hyun Kim, ; Jong-Gwan Yook,

Book ID: 120970663
Publisher: IEEE
Year: 2008
Weight: 771 KB
Category: Article
ISBN: 1424426332
DOI: 10.1109/EDAPS.2008.4736037

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