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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect

✍ Scribed by Bandyopadhyay, Tapobrata; Mehrotra, Gaurav; Iyer, Mahadevan K.; Raj, P.M.; Swaminathan, Madhavan; Tummala, Rao R.

Book ID: 126732066
Publisher: IEEE
Year: 2008
Weight: 672 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550134

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