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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Manufacture and ultra-high frequency performance of an LCP-based, Z-interconnect, flip-chip package

✍ Scribed by Rowlands, Michael J.; Das, Rabindra N.

Book ID: 118021760
Publisher: IEEE
Year: 2008
Weight: 547 KB
Volume: 0
Category: Article
ISBN: 1424422302
DOI: 10.1109/ectc.2008.4550153

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