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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI)

✍ Scribed by Gang Huang, ; Naeemi, Azad; Tingdong Zhou, ; O'Connor, Dan; Muszynski, Andrew; Singh, Bhup; Becker, Dale; Venuto, James; Meindl, James D.

Book ID: 115519280
Publisher: IEEE
Year: 2008
Weight: 413 KB
Volume: 0
Category: Article
ISBN: 1424422302
DOI: 10.1109/ectc.2008.4550040

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