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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Design and development of a multi-die embedded micro wafer level package

✍ Scribed by Kripesh, Vaidyanathan; Vempati Srinivas Rao, ; Kumar, Aditya; Sharma, Gaurav; Khong Chee Houe, ; Zhang Xiaowu, ; Khoo Yee Mong, ; Navas Khan, ; Lau, John

Book ID: 125445839
Publisher: IEEE
Year: 2008
Weight: 706 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ectc.2008.4550181

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