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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Investigation of mutual inductive coupling in RF stacked-die assemblies

✍ Scribed by Frye, Robert C.; Kai Liu, ; Haijing Cao, ; Phoo Hlaing, ; Pandi Chelvam, M.

Book ID: 126742412
Publisher: IEEE
Year: 2008
Weight: 524 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550133

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