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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

✍ Scribed by Li-Cheng Shen, ; Chien-Wei Chien, ; Jin-Ye Jaung, ; Yin-Po Hung, ; Wei-Chung Lo, ; Chao-Kai Hsu, ; Yuan-Chang Lee, ; Hsien-Chie Cheng, ; Chia-Te Lin,

Book ID: 120300355
Publisher: IEEE
Year: 2008
Weight: 979 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550026

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