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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Reliability tests for a three dimensional chip stacking structure with through silicon via connections and low cost

✍ Scribed by Tzu-Ying Kuo, ; Shu-Ming Chang, ; Ying-Ching Shih, ; Chia-Wen Chiang, ; Chao-Kai Hsu, ; Ching Kuan Lee, ; Chun-Te Lin, ; Yu-Hua Chen, ; Wei-Chung Lo,

Book ID: 120828996
Publisher: IEEE
Year: 2008
Weight: 698 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550076

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