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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Lid cooling for notebooks

✍ Scribed by Varadarajan, Krishnakumar; Mongia, Rajiv K.; Pokharna, Himanshu; Pan, Jerry; Tien, Kevin; Wu, Mark

Book ID: 126320998
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 624 KB
Category: Article
ISBN: 1424417007
DOI: 10.1109/ITHERM.2008.4544322

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