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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal modeling and design of 3D integrated circuits

✍ Scribed by Jain, Ankur; Jones, Robert E.; Ritwik Chatterjee, ; Pozder, Scott; Zhihong Huang,

Book ID: 120685091
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 265 KB
Category: Article
ISBN: 1424417007
DOI: 10.1109/ITHERM.2008.4544389

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