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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Technical review of characterization methods for thermal interface Materials (TIM)

✍ Scribed by Goel, Nitin; Anoop, T.K.; Bhattacharya, A.; Cervantes, Joseph A.; Mongia, Rajiv K.; Machiroutu, Sridhar V.; Lin, Hau-Lan; Huang, Ya-Chi; Fan, Kuang-Cheng; Denq, Bar-Long; Liu, Chen-Hua; Lin, Chun-Hung; Tien, Chi-Wei; Pan, Jenq-Haur

Book ID: 120226402
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 235 KB
Category: Article
ISBN: 1424417007
DOI: 10.1109/ITHERM.2008.4544277

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