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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

✍ Scribed by Yang, Mingshan; He, Jie; Li, Linkai; Xu, Wenyu

Book ID: 126699226
Publisher: IEEE
Year: 2007
Weight: 802 KB
Category: Article
ISBN: 1424413923
DOI: 10.1109/ICEPT.2007.4441431

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