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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications

✍ Scribed by Tao, Zhiqiang; Ding, Jiapei; Yang, Haixia; Fan, Lin; Yang, Shiyong

Book ID: 126642958
Publisher: IEEE
Year: 2007
Weight: 154 KB
Category: Article
ISBN: 1424413923
DOI: 10.1109/ICEPT.2007.4441455

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