𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - A Computational Model of a Molten Solder Droplet Spreading on Orthogonal Pads

✍ Scribed by Tian, Dewen; Wang, Chunqing; Tian, Yanhong

Book ID: 121335260
Publisher: IEEE
Year: 2007
Weight: 619 KB
Category: Article
ISBN: 1424413923
DOI: 10.1109/ICEPT.2007.4441464

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Electroless NiMoP Thin Film Deposition on Si/SiO2

✍ Ling, Qiang; Cai, Jian; Wang, Shuidi; Zhao, Huiyou 📂 Article 📅 2007 🏛 IEEE ⚖ 931 KB

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - A Sensor Integrated Ultra-long Span LED Street Lamp System

✍ Wang, Kai; Liu, Sheng 📂 Article 📅 2007 🏛 IEEE ⚖ 879 KB

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications

✍ Tao, Zhiqiang; Ding, Jiapei; Yang, Haixia; Fan, Lin; Yang, Shiyong 📂 Article 📅 2007 🏛 IEEE ⚖ 154 KB

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

✍ Yang, Mingshan; He, Jie; Li, Linkai; Xu, Wenyu 📂 Article 📅 2007 🏛 IEEE ⚖ 802 KB

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Measurement and Instruments - Xian, China (2007.08.16-2007.07.18)] 2007 8th International Conference on Electronic Measurement and Instruments - Study on Measurement and Processing Technology of Electromyography

✍ Xiaodong, Zhang; Haojie, Luan 📂 Article 📅 2007 🏛 IEEE ⚖ 716 KB

[IEEE 2007 8th International Conference

[IEEE 2007 8th International Conference on Electronic Measurement and Instruments - Xian, China (2007.08.16-2007.07.18)] 2007 8th International Conference on Electronic Measurement and Instruments - Design and Realization Technology of High-Frequency Attenuator

✍ Xiaoming, Chang; Haiyuan, Wang; Zheng, Wang; Li Yuanyuan, 📂 Article 📅 2007 🏛 IEEE ⚖ 658 KB