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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Wafer level package of Wideband Microwave Transmission System and Integrated Microwave Antenna using BCB/Metal structure with the die embedded in Si substrate

✍ Scribed by Wang, Tianxi; Han, Mei; Xu, Gaowei; Luo, Le

Book ID: 125845860
Publisher: IEEE
Year: 2013
Weight: 863 KB
Category: Article
ISBN: 1479904988
DOI: 10.1109/ICEPT.2013.6756411

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