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[IEEE 2002 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, USA (11-13 June 2002)] 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) - A robust embedded ladder-oxide/Cu multilevel interconnect technology for 0.13 μm CMOS generation

✍ Scribed by Oda, N.; Ito, S.; Takewaki, T.; Kunishima, H.; Hironaga, N.; Honma, I.; Namba, H.; Yokogawa, S.; Goto, T.; Usami, T.; Ohto, K.; Kubo, A.; Aoki, H.; Suzuki, M.; Yamamoto, Y.; Watanabe, S.; Takeda, T.; Yamada, K.; Kosaka, M.; Horiuchi, T.

Book ID: 126612771
Publisher: IEEE
Year: 2002
Weight: 306 KB
Category: Article
ISBN-13: 9780780373129
DOI: 10.1109/VLSIT.2002.1015377

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