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[IEEE 2001 IEEE International Integrated Reliability Workshop. Final Report - Lake Tahoe, CA, USA (15-18 Oct. 2001)] 2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580) - Relationship between TDDB testing and wafer level ramped QBD testing using both fixed current and current density stressing

✍ Scribed by Mullen, E.; Leveugle, C.; Molyneaux, J.; Prendergast, J.; Suehle, J.S.

Book ID: 121081885
Publisher: Ieee
Year: 2001
Weight: 315 KB
Edition: 2001
Category: Article
ISBN-13: 9780780371675
DOI: 10.1109/.2001.993921

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