𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 1999 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (18-21 Oct. 1999)] 1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) - A methodology to assess the influence of Burn In related to long-term reliability of submicron CMOS transistors

✍ Scribed by Holzhauser, S.; Narr, A.

Book ID: 126631080
Publisher: IEEE
Year: 1999
Weight: 354 KB
Category: Article
ISBN-13: 9780780356498
DOI: 10.1109/IRWS.1999.830550

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 1999 IEEE International Integrated

[IEEE 1999 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (18-21 Oct. 1999)] 1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) - Modeling of polycrystalline silicon thermal coefficient of resistance

✍ Kumar, S.; Bouknight, L. 📂 Article 📅 1999 🏛 IEEE ⚖ 267 KB

[IEEE 1999 IEEE International Integrated

[IEEE 1999 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (18-21 Oct. 1999)] 1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) - Breakdown voltage distribution and extrinsic TDDB failures of MOS gate oxides

✍ Katto, H. 📂 Article 📅 1999 🏛 IEEE ⚖ 520 KB

[IEEE 2000 IEEE International Integrated

[IEEE 2000 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (23-26 Oct. 2000)] 2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515) - On the methodology of assessing hot-carrier reliability of analog circuits

✍ Le, H.; Marcoux, P.J.; Jiang, W.; Chung, J.E. 📂 Article 📅 2000 🏛 IEEE ⚖ 340 KB

[IEEE 2001 IEEE International Integrated

[IEEE 2001 IEEE International Integrated Reliability Workshop. Final Report - Lake Tahoe, CA, USA (15-18 Oct. 2001)] 2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580) - The influence of temperature gradients in isothermal electromigration tests

✍ Leong, A.Y.K.; Turner, T.E. 📂 Article 📅 2001 🏛 IEEE ⚖ 320 KB

[IEEE IEEE International Integrated Reli

[IEEE IEEE International Integrated Reliability Workshop Final Report, 2004 - S. Lake Tahoe, CA, USA (Oct. 18-21, 2004)] IEEE International Integrated Reliability Workshop Final Report, 2004 - Fast wafer level data acquisition for reliability characterization of sub-100 nm CMOS technologies

✍ Kerber, A.; Kerber, M. 📂 Article 📅 2004 🏛 IEEE ⚖ 284 KB

[IEEE 2000 IEEE International Integrated

[IEEE 2000 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, USA (23-26 Oct. 2000)] 2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515) - Method for the extraction of extrinsic data for oxide quality assessment

✍ Martin, A.; Diestel, G. 📂 Article 📅 2000 🏛 IEEE 🌐 English ⚖ 219 KB