✦ LIBER ✦

IC packaging and interconnections-status and trends

✍ Scribed by Pfahnl, Arnold

Book ID: 112089421
Publisher: John Wiley and Sons
Year: 1990
Tongue: English
Weight: 411 KB
Volume: 1
Category: Article
ISSN: 1124-318X
DOI: 10.1002/ett.4460010219

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