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High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure

✍ Scribed by Zhihua Dong; Jinyan Wang; C.P. Wen; Shenghou Liu; Rumin Gong; Min Yu; Yilong Hao; Fujun Xu; Bo Shen; Yangyuan Wang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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Dislocation-induced nonuniform interfaci

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High-Temperature Characteristics of Ti/A

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Role of Ti/Al relative thickness in the

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Correlation between microstructure and t

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Formation of Ta/Ti/Al/Mo/Au ohmic contac

✍ Osipov, K. Yu.; Velikovskiy, L. E.; Kagadei, V. A. 📂 Article 📅 2014 🏛 Springer 🌐 English ⚖ 461 KB