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High-resolution measurements of the thermal expansion of superconducting Co-doped

✍ Scribed by da Luz, M. S.; Neumeier, J. J.; Bollinger, R. K.; Sefat, A. S.; McGuire, M. A.; Jin, R.; Sales, B. C.; Mandrus, D.


Book ID
120079621
Publisher
The American Physical Society
Year
2009
Tongue
English
Weight
763 KB
Volume
79
Category
Article
ISSN
1098-0121

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## Abstract We measured the thermal expansion coefficient (TEC) of a vertically stacked multi‐quantum‐well (MQW) structure buried under a thick GaAs top layer before and after lateral patterning of the GaAs top layer. After patterning the TEC of the whole MQW structure differs from that of the plan