High resolution measurement of the thermal expansion coefficient of semiconductor multilayer lateral nanostructures

✍ Scribed by Brüser, B. ;Panzner, T. ;Grigorian, S. ;Grenzer, J. ;Zorn, M. ;Zeimer, U. ;Pietsch, U.

• Publisher: John Wiley and Sons
• Year: 2008
• Tongue: English
• Weight: 381 KB
• Volume: 205
• Category: Article
• ISSN: 0031-8965
• DOI: 10.1002/pssa.200723387

✦ Synopsis

Abstract

We measured the thermal expansion coefficient (TEC) of a vertically stacked multi‐quantum‐well (MQW) structure buried under a thick GaAs top layer before and after lateral patterning of the GaAs top layer. After patterning the TEC of the whole MQW structure differs from that of the planar structure by about 20%. Based on calculations in terms of methods of finite elements the effect is explained by the influence of the strain field originating from the bottom edges of the etched nanostructure. Due to the long range nature of this strain field the strain release within the individual quantum wells changes as a function from the distance from the valley. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)