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The thermal expansion coefficient of AIIIBV multilayer structure

✍ Scribed by Bak-Misiuk, J. ;Wolf, J. ;Pietsch, U.


Publisher
John Wiley and Sons
Year
1990
Tongue
English
Weight
456 KB
Volume
118
Category
Article
ISSN
0031-8965

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## Abstract We measured the thermal expansion coefficient (TEC) of a vertically stacked multi‐quantum‐well (MQW) structure buried under a thick GaAs top layer before and after lateral patterning of the GaAs top layer. After patterning the TEC of the whole MQW structure differs from that of the plan