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High-Resolution Thermal Expansion of MgB2

✍ Scribed by R. Lortz; C. Meingast; D. Ernst; B. Renker; D. D. Lawrie; J. P. Franck


Book ID
110437002
Publisher
Springer US
Year
2003
Tongue
English
Weight
285 KB
Volume
131
Category
Article
ISSN
0022-2291

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## Abstract We measured the thermal expansion coefficient (TEC) of a vertically stacked multi‐quantum‐well (MQW) structure buried under a thick GaAs top layer before and after lateral patterning of the GaAs top layer. After patterning the TEC of the whole MQW structure differs from that of the plan