A new damascene architecture for high-pe
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A. Farcy; J. Torres; V. Arnal; M. Fayolle; H. Feldis; F. Jourdan; M. Assous; J.L
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Article
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2003
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Elsevier Science
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English
⚖ 510 KB
As high-performance metal-insulator-metal capacitors are required for new technologies, an innovative architecture was developed with standard damascene processes used for copper interconnect realization. Low-cost damascene capacitors were 2 integrated with thin Si N films, leading to 2.9 fF / mm ca