✦ LIBER ✦

Hermetic seal for electronic component

Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 135 KB
Volume: 2003
Category: Article
ISSN: 1350-4789
DOI: 10.1016/s1350-4789(03)04016-9

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✦ Synopsis

Applicant: Epcos AG, Germany

This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the film, and providing a hermetic sealing layer, especially a metal layer, which creates a seal with the support.

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