## Applicant: Epcos AG, Germany This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and th
Hermetic seal for a LED array
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 145 KB
- Volume
- 2002
- Category
- Article
- ISSN
- 1350-4789
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