Hermetic seal for semiconductor packages
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 122 KB
- Volume
- 2003
- Category
- Article
- ISSN
- 1350-4789
No coin nor oath required. For personal study only.
โฆ Synopsis
CALENDAR
having a first sealing portion which is contiguous with the top portion. The rib further includes a second sealing portion that is separated from the top portion by the first portion and which, prior to attachment of the closure to the container, extends inwardly to a free edge. The closure further has a continuous nub member extending downwards and outwards from the underside of the top portion that is positioned radially inwards of the first sealing portion. On attachment of the closure to the container end portion, the nub member seals with the inner surface of the container end portion and the sealing rib seals the outer surface.
๐ SIMILAR VOLUMES
## Applicant: Epcos AG, Germany This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and th