๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Hermetic seal for semiconductor packages


Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
122 KB
Volume
2003
Category
Article
ISSN
1350-4789

No coin nor oath required. For personal study only.

โœฆ Synopsis


CALENDAR

having a first sealing portion which is contiguous with the top portion. The rib further includes a second sealing portion that is separated from the top portion by the first portion and which, prior to attachment of the closure to the container, extends inwardly to a free edge. The closure further has a continuous nub member extending downwards and outwards from the underside of the top portion that is positioned radially inwards of the first sealing portion. On attachment of the closure to the container end portion, the nub member seals with the inner surface of the container end portion and the sealing rib seals the outer surface.


๐Ÿ“œ SIMILAR VOLUMES


Hermetic seal for electronic component
๐Ÿ“‚ Article ๐Ÿ“… 2003 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 135 KB

## Applicant: Epcos AG, Germany This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and th