## Applicant: Epcos AG, Germany This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and th
Hermetic seal for an electronic device
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 322 KB
- Volume
- 2011
- Category
- Article
- ISSN
- 1350-4789
No coin nor oath required. For personal study only.
โฆ Synopsis
A labyrinth seal arrangement that is designed to simplify assembly procedures is described by this patent. The labyrinth segments ( ) can be moved radially. During assembly, a bar ( ) is fed through holes in the seal housing and labyrinth segments in order to hold them clear of the shaft. When the seal components are in position, the rod is removed and the seal segments move radially inwards to a sealing position.
๐ SIMILAR VOLUMES
A porous ceramic that can be used for mechanical seal faces is described. The pores are not less than 5 ยตm, and are compressed into an elliptical shape with the minor diameter parallel to the direction of sliding. The value of the cross-sectional area of the pores relative to a circular pore is defi
the bearing. This circumferentially uniform fluid pressure, by itself, or in combination with a flexible lip (44), prevents contaminant ingress between the rotating shaft and the end-cap of the bearing housing. The structure (15) that creates the tangential fluid-flow is part of the removable cartri
A patent for the zipper of re-closable packages that includes an impressed pattern which is impinged against by the slider is described. This creates an aesthetically pleasing appearance and sound as the closure is operated. A corresponding tactile sensation is also created. A number of variations a