Hafnium silicon oxide films prepared by atomic layer deposition
✍ Scribed by Kaupo Kukli; Mikko Ritala; Markku Leskelä; Timo Sajavaara; Juhani Keinonen; David C Gilmer; Philip J Tobin
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 107 KB
- Volume
- 109
- Category
- Article
- ISSN
- 0921-5107
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## Abstract HfO~2~ films were grown by atomic layer deposition (ALD) from a new liquid precursor, Hf(ONEt~2~)~4~ and H~2~O, at temperatures between 250 °C and 350 °C on borosilicate glass and Si(100) substrates. The highest growth rate was achieved at 300 °C, whereas the growth was essentially slow
Thin cubic Gd 2 O 3 films are grown by atomic layer deposition (ALD), in the temperature range 300-400 °C, using a novel tris(2,3-dimethyl-2-butoxy)gadolinium(III) precursor, Gd[OC(CH 3 ) 2 CH(CH 3 ) 2 ] 3 , and water. The films are crystalline in their as-deposited state. The films contain some res