✦ LIBER ✦

Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification

✍ Scribed by J. Shen; Y.C. Chan; S.Y. Liu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Growth mechanisms of interfacial interme

✍ Yu, Chi-Yang; Duh, Jenq-Gong 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 942 KB

Formation of bulk Cu6Sn5intermetallic co

✍ J. Shen; Y. C. Liu; H. X. Gao 📂 Article 📅 2007 🏛 Springer 🌐 English ⚖ 331 KB

On the Nature of the Interface between A

✍ Rajen S. Sidhu; Shantanu V. Madge; Xin Deng; Nikhilesh Chawla 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 401 KB

Intermetallic compounds growth between S

✍ D.Q. Yu; C.M.L. Wu; C.M.T. Law; L. Wang; J.K.L. Lai 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 526 KB

Microstructure, solderability, and growt

✍ C. M. T. Law; C. M. L. Wu; D. Q. Yu; L. Wang; J. K. L. Lai 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 242 KB

Evolution of Ag3Sn compound formation in

✍ H.W. Tseng; C.Y. Liu 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 737 KB