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Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al

✍ Scribed by K. Meguro; M. O; M. Kajihara


Book ID
113069896
Publisher
Springer
Year
2012
Tongue
English
Weight
449 KB
Volume
47
Category
Article
ISSN
0022-2461

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The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th