Growth and fabrication of AlGaN/GaN HEMT based on Si(1 1 1) substrates by MOCVD
β Scribed by Weijun Luo; Xiaoliang Wang; Hongling Xiao; Cuimei Wang; Junxue Ran; Lunchun Guo; Jianping Li; Hongxin Liu; Yanling Chen; Fuhua Yang; Jinmin Li
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 262 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0026-2692
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β¦ Synopsis
AlGaN/GaN high electron mobility transistor (HEMT) hetero-structures were grown on the 2-in Si (1 1 1) substrate using metalorganic chemical vapor deposition (MOCVD). Low-temperature (LT) AlN layers were inserted to relieve the tension stress during the growth of GaN epilayers. The grown AlGaN/GaN HEMT samples exhibited a maximum crack-free area of 8 mm Γ 5 mm, XRD GaN (0 0 0 2) full-width at half-maximum (FWHM) of 661 arcsec and surface roughness of 0.377 nm. The device with a gate length of 1.4 mm and a gate width of 60 mm demonstrated maximum drain current density of 304 mA/mm, transconductance of 124 mS/mm and reverse gate leakage current of 0.76 mA/mm at the gate voltage of Γ10 V.
π SIMILAR VOLUMES
GaN nanorods were synthesized in mass by ammoniating Ga 2 O 3 films sputtered on Si(111) substrates using cobalt as a catalyst. X-ray diffraction, scanning electron microscope, high-resolution transmission electron microscopy, X-ray photoelectron spectroscopy and photoluminescence were used to chara
A single high temperature AlN (HT-AlN) buffer has been used to relieve the stress in the growth of GaN epilayers on Si (1 1 1) substrates, but the growth of crack-free GaN on Si is still difficult due to the large mismatch of the lattice and coefficient of thermal-expansion (CTE) between GaN and Si.
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