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Growth and fabrication of AlGaN/GaN HEMT based on Si(1 1 1) substrates by MOCVD

✍ Scribed by Weijun Luo; Xiaoliang Wang; Hongling Xiao; Cuimei Wang; Junxue Ran; Lunchun Guo; Jianping Li; Hongxin Liu; Yanling Chen; Fuhua Yang; Jinmin Li


Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
262 KB
Volume
39
Category
Article
ISSN
0026-2692

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✦ Synopsis


AlGaN/GaN high electron mobility transistor (HEMT) hetero-structures were grown on the 2-in Si (1 1 1) substrate using metalorganic chemical vapor deposition (MOCVD). Low-temperature (LT) AlN layers were inserted to relieve the tension stress during the growth of GaN epilayers. The grown AlGaN/GaN HEMT samples exhibited a maximum crack-free area of 8 mm Γ‚ 5 mm, XRD GaN (0 0 0 2) full-width at half-maximum (FWHM) of 661 arcsec and surface roughness of 0.377 nm. The device with a gate length of 1.4 mm and a gate width of 60 mm demonstrated maximum drain current density of 304 mA/mm, transconductance of 124 mS/mm and reverse gate leakage current of 0.76 mA/mm at the gate voltage of Γ€10 V.


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