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Grain growth in copper interconnect lines

✍ Scribed by W. Wu; D. Ernur; S.H. Brongersma; M. Van Hove; K. Maex

Book ID: 104050230
Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 392 KB
Volume: 76
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.07.053

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