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Local textures and grain boundaries in voided copper interconnects

✍ Scribed by R. R. Keller; J. A. Nucci; D. P. Field

Book ID: 107457587
Publisher: Springer US
Year: 1997
Tongue: English
Weight: 730 KB
Volume: 26
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-997-0236-z

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