Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation

✍ Scribed by Takashi Onishi; Masao Mizuno; Tetsuya Yoshikawa; Jun Munemasa; Takao Inoue; Aki Miyagaki; Hisashi Nakamoto

• Book ID: 107456992
• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 695 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1311-4