✦ LIBER ✦
A grain structure based statistical simulation of electromigration damage in chip level interconnect lines
✍ Scribed by T.M. Korhonen; D.D. Brown; M.A. Korhonen
- Book ID
- 108361790
- Publisher
- Elsevier Science
- Year
- 2000
- Tongue
- English
- Weight
- 233 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0026-2714
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