✦ LIBER ✦

GaN-on-Si research

Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 376 KB
Volume: 16
Category: Article
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(03)00984-0

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✦ Synopsis

Designed for the development of compound semiconductors, MEMS and advanced packaging, Süss MicroTec has introduced two new substrate bonders, the SB6e (for 6" substrates) and SB8e (for 8" substrates).

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